QMK212B7152MG-T [TAIYO YUDEN]
Ceramic Capacitor, Multilayer, Ceramic, 250V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.0015uF, Surface Mount, 0805, CHIP, LEAD FREE;型号: | QMK212B7152MG-T |
厂家: | TAIYO YUDEN (U.S.A.), INC |
描述: | Ceramic Capacitor, Multilayer, Ceramic, 250V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.0015uF, Surface Mount, 0805, CHIP, LEAD FREE |
文件: | 总15页 (文件大小:503K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Notice for TAIYO YUDEN productsꢀ
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2010. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and For-
eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
notice_e-01
MEDIUM-HIGH VOLTAGE MULTILAYER CERAMIC CAPACITORS
REFLOW
■ FEATURES
■ APPLICATIONS
◦ꢀThe use of nickel as electrode material prevents migration and pro-
◦Gꢀ eneral telephone exchange
◦Iꢀnverter
vides high reliability.
◦ꢀSmall case sizes with high rated voltage.
◦Wꢀ ireless and Telecommunication base
◦Fꢀ or DC/DC Converter
■ PART NUMBER
H M K 3 1 6 △ B J 1 0 4 K L - T △
❶
❷
❸
❹
❺
❻
❼
❽
❾
❿
⓫
⓬
❻Temperature
❹Dimension
⓬Internal code
Standard
△=Blank space
❾Thickness
〔mm〕
❿Special code
❶Rated
❽Special code
❸End
characteristics code
voltage〔VDC〕
Type (inch) L×W[mm]
107 (0603) 1.6×0.8
212 (0805) 2.0×1.25
316 (1206) 3.2×1.6
325 (1210) 3.2×2.5
432 (1812) 4.5×3.2
termination
Plated
△
-
Standard
K
±10%
±20%
B
X5R
BJ
A
0.8
0.85
1.25
1.15
1.6
H
Q
S
100
250
630
K
M
D
G
F
C7
B7
X7S
X7R
⓫Packaging
❷Series name
Multilayer ceramic
capacitor
φ178mm Taping
(4mm pitch)
T
❼Nominal
capacitance〔pF〕
M
❺Dimension
tolerance
L
N
M
1.9
example
104
105
△
Standard
2.5
100,000
△=Blank space
1,000,000
■ STANDARD EXTERNAL DIMENSIONS/STANDARD QUANTITY
Dimension [mm]
Standard quantity [pcs]
Paper tape Embossed tape
Type
L
W
T
e
□MK107
1.6±0.10
0.8±0.10
1.25±0.10
1.6±0.15
2.5±0.20
3.2±0.30
0.8±0.10
A
0.35±0.25
0.5±0.25
4000
-
(0603 inch)
0.85±0.10
1.25±0.10
1.15±0.10
1.6±0.20
1.15±0.10
1.9±0.20
D
G
F
4000
-
□MK212
(0805 inch)
2.0±0.10
3.2±0.15
3.2±0.3
4.5±0.4
-
3000
3000
2000
□MK316
(1206 inch)
0.5 +0.35/ー0.25
0.6±0.3
-
-
-
L
F
□MK325
(1210 inch)
2000
500
N
□MK432
(1812 inch)
2.5±0.20
M
0.9±0.6
■ AVAILABLE CAPACITANCE RANGE
107
212
316
325
432
Type
X7R X7S B/X5R
X7R
B/X5R
X7R
B/X5R
X7R
B/X5R
X7R
B/X5R
Cap
[μF]
VDC
[3-digit]
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
100 100 100 100 250 100 250 100 250 630 100 250 630 100 250 630 100 250 630 100 250 630 100 250 630
0.001
0.0015
0.0022
0.0033
0.0047
0.0068
0.01
0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
D
D
D
D
G
G
G
G
G
D
D
D
D
G
G
G
G
G
F
F
F
F
F
F
F
L
L
F
F
F
F
F
F
F
L
L
G
G
G
G
G
G
G
G
G
G
G
G
G
G
N
N
N
N
N
N
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
N
N
M
M
M
M
M
M
A
A
F
N
N
N
N
N
N
N
N
N
F
N
N
N
N
N
N
N
N
N
M
M
G
G
M
M
M
M
M
M
M
M
684
105
155
225
L
L
M
M
M
M
M
M
N
N
※Letters in the table indicate thickness.
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc06_e-01
26
■ AVAILABLE CAPACITANCE RANGE
Temperature characteristics
Temperature range〔℃〕
-25~+85
Capacitance tolerance
Temp.char.Code
〔%〕
Applicable standard
Ref. Temp〔. ℃〕
Capacitance chang〔e %〕
JIS
B
20
25
25
25
±10
±15
±22
±15
BJ
EIA
X5R
X7S
X7R
-55~+85
-55~+125
-55~+125
±10(K)
±20(M)
C7
B7
EIA
EIA
■ REPRESENTATIVE PART NUMBERS
●107TYPE
【Temperature Characteristic BJ:B/X5R】
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
100V
HMK107 BJ102□A
HMK107 BJ152□A
HMK107 BJ222□A
HMK107 BJ332□A
HMK107 BJ472□A
HMK107 BJ682□A
HMK107 BJ103□A
HMK107 BJ153□A
HMK107 BJ223□A
HMK107 BJ333□A
HMK107 BJ104□A
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
1000
1500
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
R
R
R
R
R
R
R
R
R
R
R
200%
200%
200%
200%
200%
200%
200%
200%
200%
200%
200%
2200
3300
4700
6800
10000
15000
22000
33000
100000
Capacitance tolerance code is applied to □ of part number.
*1ꢁWe may provide X7R for some itemes according to the individual specification.
【Temperature CharacteristicꢁB7:X7R, C7:X7S】
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
100V
HMK107 B7102□A
HMK107 B7152□A
HMK107 B7222□A
HMK107 B7332□A
HMK107 B7472□A
HMK107 B7682□A
HMK107 B7103□A
HMK107 B7153□A
HMK107 B7223□A
HMK107 B7333□A
HMK107 C7104□A
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7S
1000
1500
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
R
R
R
R
R
R
R
R
R
R
R
200%
200%
200%
200%
200%
200%
200%
200%
200%
200%
200%
2200
3300
4700
6800
10000
15000
22000
33000
100000
Capacitance tolerance code is applied to □ of part number.
●212TYPE
【Temperature CharacteristicꢁBJ:B/X5R】
・1.25mm thicknes(s G)
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
100V
HMK212 BJ103□G
HMK212 BJ153□G
HMK212 BJ223□G
HMK212 BJ333□G
HMK212 BJ473□G
HMK212 BJ683□G
HMK212 BJ104□G
HMK212 BJ224□G
QMK212 BJ472□G
QMK212 BJ682□G
QMK212 BJ103□G
QMK212 BJ153□G
QMK212 BJ223□G
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
10000
15000
22000
33000
47000
68000
100000
220000
4700
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
R
R
R
R
R
R
R
R
R
R
R
R
R
200%
200%
200%
200%
200%
200%
200%
200%
150%
150%
150%
150%
150%
250V
6800
10000
15000
22000
・0.85mm thicknes(s D)
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
250V
QMK212 BJ102□D
QMK212 BJ152□D
QMK212 BJ222□D
QMK212 BJ332□D
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
1000
1500
2200
3300
±10, ±20
±10, ±20
±10, ±20
±10, ±20
2.5
2.5
2.5
2.5
0.85±0.1
0.85±0.1
0.85±0.1
0.85±0.1
R
R
R
R
150%
150%
150%
150%
Capacitance tolerance code is applied to □ of part number.
*1ꢁWe may provide X7R for some itemes according to the individual specification.
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc06_e-01
27
■ REPRESENTATIVE PART NUMBERS
【Temperature CharacteristicꢁB7:X7R】
・1.25mm thicknes(s G)
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
100V
HMK212 B7103□G
HMK212 B7153□G
HMK212 B7223□G
HMK212 B7333□G
HMK212 B7473□G
HMK212 B7683□G
HMK212 B7104□G
HMK212 B7224□G
QMK212 B7472□G
QMK212 B7682□G
QMK212 B7103□G
QMK212 B7153□G
QMK212 B7223□G
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
10000
15000
22000
33000
47000
68000
100000
220000
4700
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
1.25±0.1
R
R
R
R
R
R
R
R
R
R
R
R
R
200%
200%
200%
200%
200%
200%
200%
200%
150%
150%
150%
150%
150%
250V
6800
10000
15000
22000
・0.85mm thicknes(s D)
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
250V
QMK212 B7102□D
QMK212 B7152□D
QMK212 B7222□D
QMK212 B7332□D
X7R
X7R
X7R
X7R
1000
1500
2200
3300
±10, ±20
±10, ±20
±10, ±20
±10, ±20
2.5
2.5
2.5
2.5
0.85±0.1
0.85±0.1
0.85±0.1
0.85±0.1
R
R
R
R
150%
150%
150%
150%
Capacitance tolerance code is applied to □ of part number.
●316TYPE
【Temperature CharacteristicꢁBJ:B/X5R】
・1.6mm thicknes(s L)
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
100V
HMK316 BJ473□L
HMK316 BJ683□L
HMK316 BJ104□L
HMK316 BJ154□L
HMK316 BJ224□L
HMK316 BJ334□L
HMK316 BJ474□L
HMK316 BJ105□L
QMK316 BJ333□L
QMK316 BJ473□L
QMK316 BJ683□L
QMK316 BJ104□L
SMK316 BJ153□L
SMK316 BJ223□L
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
47000
68000
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
R
R
R
R
R
R
R
R
R
R
R
R
R
R
200%
200%
200%
200%
200%
200%
200%
200%
150%
150%
150%
150%
120%
120%
100000
150000
220000
330000
470000
1000000
33000
250V
630V
47000
68000
100000
15000
22000
・1.15mm thicknes(s F)
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
630V
SMK316 BJ102□F
SMK316 BJ152□F
SMK316 BJ222□F
SMK316 BJ332□F
SMK316 BJ472□F
SMK316 BJ682□F
SMK316 BJ103□F
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
1000
1500
2200
3300
4700
6800
10000
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
2.5
2.5
2.5
2.5
2.5
2.5
2.5
1.15±0.1
1.15±0.1
1.15±0.1
1.15±0.1
1.15±0.1
1.15±0.1
1.15±0.1
R
R
R
R
R
R
R
120%
120%
120%
120%
120%
120%
120%
Capacitance tolerance code is applied to □ of part number.
*1ꢁWe may provide X7R for some itemes according to the individual specification.
【Temperature CharacteristicꢁB7:X7R】
・1.6mm thicknes(s L)
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
100V
HMK316 B7473□L
HMK316 B7683□L
HMK316 B7104□L
HMK316 B7154□L
HMK316 B7224□L
HMK316 B7334□L
HMK316 B7474□L
HMK316 B7105□L
QMK316 B7333□L
QMK316 B7473□L
QMK316 B7683□L
QMK316 B7104□L
SMK316 B7153□L
SMK316 B7223□L
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
47000
68000
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
R
R
R
R
R
R
R
R
R
R
R
R
R
R
200%
200%
200%
200%
200%
200%
200%
200%
150%
150%
150%
150%
120%
120%
100000
150000
220000
330000
470000
1000000
33000
250V
630V
47000
68000
100000
15000
22000
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc06_e-01
28
■ REPRESENTATIVE PART NUMBERS
・1.15mm thicknes(s F)
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
630V
SMK316 B7102□F
SMK316 B7152□F
SMK316 B7222□F
SMK316 B7332□F
SMK316 B7472□F
SMK316 B7682□F
SMK316 B7103□F
X7R
X7R
X7R
X7R
X7R
X7R
X7R
1000
1500
2200
3300
4700
6800
10000
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
2.5
2.5
2.5
2.5
2.5
2.5
2.5
1.15±0.1
1.15±0.1
1.15±0.1
1.15±0.1
1.15±0.1
1.15±0.1
1.15±0.1
R
R
R
R
R
R
R
120%
120%
120%
120%
120%
120%
120%
Capacitance tolerance code is applied to □ of part number.
●325TYPE
【Temperature CharacteristicꢁBJ:B/X5R】
・1.9mm thicknes(s N)
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
100V
HMK325 BJ154□N
HMK325 BJ224□N
HMK325 BJ334□N
HMK325 BJ474□N
HMK325 BJ684□N
HMK325 BJ105□N
HMK325 BJ225□N
QMK325 BJ473□N
QMK325 BJ104□N
QMK325 BJ154□N
QMK325 BJ224□N
SMK325 BJ223□N
SMK325 BJ333□N
SMK325 BJ473□N
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
150000
220000
330000
470000
680000
1000000
2200000
47000
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
R
R
R
R
R
R
R
R
R
R
R
R
R
R
200%
200%
200%
200%
200%
200%
200%
150%
150%
150%
150%
120%
120%
120%
250V
630V
100000
150000
220000
22000
33000
47000
・1.15mm thicknes(s F)
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
Thickness
〔mm〕
Part number 1
HMK325 BJ104□F
Part number 2
Note
% Rated
voltage
〔%〕
100V
B/X5R*1
100000
±10, ±20
3.5
1.15±0.1
R
200%
Capacitance tolerance code is applied to □ of part number.
*1ꢁWe may provide X7R for some itemes according to the individual specification.
【Temperature CharacteristicꢁB7:X7R】
・1.9mm thicknes(s N)
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
100V
HMK325 B7154□N
HMK325 B7224□N
HMK325 B7334□N
HMK325 B7474□N
HMK325 B7684□N
HMK325 B7105□N
HMK325 B7225□N
QMK325 B7473□N
QMK325 B7104□N
QMK325 B7154□N
QMK325 B7224□N
SMK325 B7223□N
SMK325 B7333□N
SMK325 B7473□N
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
150000
220000
330000
470000
680000
1000000
2200000
47000
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
R
R
R
R
R
R
R
R
R
R
R
R
R
R
200%
200%
200%
200%
200%
200%
200%
150%
150%
150%
150%
120%
120%
120%
250V
630V
100000
150000
220000
22000
33000
47000
・1.15mm thicknes(s F)
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
100V
HMK325 B7104□F
X7R
100000
±10, ±20
3.5
1.15±0.1
R
200%
Capacitance tolerance code is applied to □ of part number.
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc06_e-01
29
■ REPRESENTATIVE PART NUMBERS
●432TYPE
【Temperature CharacteristicꢁBJ:B/X5R】
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
100V
HMK432 BJ474□M
HMK432 BJ105□M
HMK432 BJ155□M
HMK432 BJ225□M
QMK432 BJ104□M
QMK432 BJ224□M
QMK432 BJ334□M
QMK432 BJ474□M
SMK432 BJ473□M
SMK432 BJ683□M
SMK432 BJ104□M
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
470000
1000000
1500000
2200000
100000
220000
330000
470000
47000
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
R
R
R
R
R
R
R
R
R
R
R
200%
200%
200%
200%
150%
150%
150%
150%
120%
120%
120%
250V
630V
68000
100000
Capacitance tolerance code is applied to □ of part number.
*1ꢁWe may provide X7R for some itemes according to the individual specification.
【Temperature CharacteristicꢁB7:X7R】
HALT
Capacitance
tolerance
〔%〕
Soldering
R:Reflow
W:Wave
Internal
code
(P/N 1)
Rated
voltage
Temp.
char.
Capacitance
〔pF〕
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
100V
250V
630V
HMK432 B7474□M
HMK432 B7105□M
HMK432 B7155□M
HMK432 B7225□M
QMK432 B7104□M
QMK432 B7224□M
QMK432 B7334□M
QMK432 B7474□M
SMK432 B7473□M
SMK432 B7683□M
SMK432 B7104□M
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
470000
1000000
1500000
2200000
100000
220000
330000
470000
47000
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
2.5±0.2
R
R
R
R
R
R
R
R
R
R
R
200%
200%
200%
200%
150%
150%
150%
150%
120%
120%
120%
68000
100000
Capacitance tolerance code is applied to □ of part number.
■ ELECTRICAL CHARACTERISTICS
●Example of Impedance ESR vs. Frequency characteristics
Taiyo Yuden medium-high voltage ceramic capacitor
■
HMK212 BJ104KG / HMK212 B7104KG
SMK316 BJ223KL / SMK316 B7223KL
QMK325 BJ224KN / QMK325 B7224KN
HMK325 BJ105KN / HMK325 B7105KN
SMK432 BJ104KM / SMK432 B7104KM
QMK432 BJ474KM / QMK432 B7474KM
●Temperature characteristics
HMK325 BJ105KN / HMK325 B7105KN
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc06_e-01
30
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc06_e-01
31
■ PACKAGING
①Minimum Quantity
◦Taped package
③Representative taping dimensions
ꢁ◦Paper Tape(8mm wide)
ꢁ◦Pressed carrier tape(2mm pitch)
Thickness
mm
Standard quantity [pcs]
Type
Embossed
㧗0.1/−0
code
Paper tape
tape
□
MK042
0.2
0.3
C
P,T
P
—
15000
40000
□MK063
0.3
□2K096
0.45
0.3
K
10000
P
□WK105
0.5
V
—
T1
0.2
C
P
20000
15000
□MK105
□VK105
0.3
0.5
V, W
W
K
Unit:mm
10000
0.5
Chip Cavity
Insertion Pitch
Tape Thickness
Type
0.45
0.5
4000
A
B
F
T
T1
□MK107
□WK107
V
—
4000
□MK063
□WK105
0.37
0.67
0.45max.
0.42max.
0.42max.
2.0±0.05
0.8
A
0.65
1.15
0.45max.
0.5
V
□2K110
0.6
B
4000
—
0.8
A
◦Punched carrier tape(2mm pitch)
0.45
0.85
1.25
0.85
0.85
0.85
1.15
1.25
1.6
K
□MK212
□WK212
D
㧗0.1/−0
G
D
—
3000
□4K212
□2K212
D
4000
—
D
F
□MK316
3000
2000
G
L
—
0.85
1.15
1.9
D
Unit:mm
F
Chip Cavity
Type
Insertion Pitch
Tape Thickness
T
□MK325
N
Y
—
—
A
B
F
2.0max
2.5
0.45max.
0.6max.
M
M
500(T), 1000(P)
□2K096
0.72
1.02
□MK432
2.5
500
52.0±0.05
□MK105
□VK105
0.65
1.15
0.8max.
②Taping material
※No bottom tape for pressed carrier tape
◦Punched carrier tape(4mm pitch)
◦Paper tape
㧗0.1/−0
Unit:mm
Chip Cavity
Type
Insertion Pitch
F
Tape Thickness
T
A
B
□MK107
□WK107
□2K110
1.0
1.15
1.8
1.1max.
1.0max.
◦Embossed tape
1.55
□MK212
□WK212
□4K212
□2K212
4.0±0.1
1.65
2.0
2.4
3.6
1.1max.
□MK316
◦Chip filled
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_pack_e-01
mlcc_pack-P1
■ PACKAGING
◦Embossed tape(4mm wide)
④Trailer and Leader
0.8±0.04
0.9±0.05
100mm or more
Trailer 160mm min.
Leader 400mm min.
1.0±0.02
2.0±0.04
F
Unit:mm
Tape Thickness
⑤Reel size
Chip Cavity
Insertion Pitch
Type
□MK042
A
B
F
K
T
t
0.23
0.43
1.0±0.02
0.5max.
0.25max.
E
C
◦Embossed tape(8mm wide)
A
㧗0.1/−0
B
D
R
W
Unit:mm
A
B
C
φ178±2.0
φ50min.
φ13.0±0.2
Unit:mm
Tape Thickness
D
E
R
Chip Cavity
Type
Insertion Pitch
F
φ21.0±0.8
2.0±0.5
1.0
A
B
K
T
□WK107
□MK212
□MK316
□MK325
1.0
1.65
2.0
2.8
1.8
2.4
3.6
3.6
1.3max
0.25±0.1
t
W
4.0±0.1
4mm wide tape
8mm wide tape
12mm wide tape
1.5max.
2.5max.
2.5max.
5±1.0
10±1.5
14±1.5
3.4max.
0.6max.
◦Embossed tape(12mm wide)
⑥Top Tape Strength
㧗0.1/−0
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow
as illustrated below.
2.0±0.1
F
⑦Bulk Cassette
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
Unit:mm
Tape Thickness
Chip Cavity
Type
Insertion Pitch
A
B
F
K
T
□MK432
3.7
4.9
8.0±0.1
4.0max.
0.6max.
12±0.1
36+0/-0.2
110±0.7
2.0+0/-0.1
1.5+0.1/-0
1.0+0/-0.1
Unit:mm
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_pack_e-01
mlcc_pack-P2
■ RELIABILITY DATA
Multilayer Ceramic Capacitors and Super Low Distortion Multilayer Ceramic
Capacitors are noted separately.
MediumーHigh Voltage Multilayer Ceramic Capacitor
1. Operating Temperature Range
Specified Value
X7R, X7S:-55~+125℃ X5R:-55~+85℃ B:-25~+85℃
2. Storage Temperature Range
Specified Value
X7R, X7S:-55~+125℃ X5R:-55~+85℃ B:-25~+85℃
100VDC, 250VDC, 630VDC
3. Rated Voltage
Specified Value
4. Withstanding Voltage(Between terminals)
Specified Value
No breakdown or damage
【Test Methods and Remarks】
Applied voltage:Rated voltage×2.5(HMK), Rated voltage×2(QMK), Rated voltage×1.2(SMK)
Duration:1 to 5sec.
Charge/discharge current:50mA max.
5.Insulation Resistance
Specified Value
100MΩμF or 10GΩ, whichever is smaller.
【Test Methods and Remarks】
Applied voltage:Rated voltage(HMK, QMK), 500V(SMK)
Duration:60±5sec.
Charge/discharge current:50mA max.
6.Capacitance(Tolerance)
Specified Value
±10%、±20%
【Test Methods and Remarks】
Measuring frequency:1kHz±10%
Measuring voltage:1±0.2Vrms
Bias application:None
7.Dissipation Factor
3.5%ma(x HMK)
2.5%ma(x QMK, SMK)
Specified Value
【Test Methods and Remarks】
Measuring frequency:1kHz±10%
Measuring voltage:1±0.2Vrms
Bias application:None
8.Temperature Characteristic of Capacitance
Specified Value
B: ±10%(-25~+85℃)
X5R:±15%(-55~+85℃)
X7R:±15%(-55~+125℃)
X7S:±22%(-55~+125℃)
【Test Methods and Remarks】
Capacitance value at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.
(C-C2)
Step
B
X5R、X7R、X7S
Minimum operating temperature
20℃ 25℃
Maximum operating temperature
×100(%)
ꢁC2
1
2
3
C
:Capacitance value in Step 1 or Step 3
C2 :Capacitance value in Step 2
9.Deflection
Appearance:No abnormality
Capacitance change:Within±10%
Specified Value
【Test Methods and Remarks】
Warp:1mm
Duration:10sec.
R-230
Test board:glass epoxy-resin substrate
Thickness:1.6mm
Capacitance measurement shall be conducted with the board bent.
10.Adhesive Strength of Terminal Electrodes
Specified Value
No terminal separation or its indication.
【Test Methods and Remarks】
Applied force:5N
Duration:30±5sec.
ꢁꢁꢁ
11.Solderability
Specified Value
At least 95% of terminal electrode is covered by new solder
【Test Methods and Remarks】
Solder type
H60A or H63A
Lead-free solder Snー3.0Agー0.5Cu
Solder temperature
Duration
Eutectic solder
230±5℃
245±3℃
4±1 sec.
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc06_reli_e-01
mlcc06_reli-R1
■ RELIABILITY DATA
12.Resistance to Soldering
Appearance:
No abnormality
Capacitance change:
Dissipation factor :
Insulation resistance:
Within±15%(HMK), ±10%(QMK, SMK)
Initial value
Initial value
Specified Value
Withstanding voltage(between terminals): No abnormality
【Test Methods and Remarks】
Preconditioning:Thermal treatmen(t at 150℃ for 1hr) Note1
Solder temperature:270±5℃
Duration:3±0.5sec.
Preheating conditions: 80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5min.
Recovery : 24±2hrs under the standard condition Note3
13.Temperature Cycle(Thermal Shock)
Appearance:
Capacitance change: Within±15%(HMK), ±7.5%(QMK, SMK)
Dissipation factor: Initial value
No abnormality
Specified Value
Insulation resistance: Initial value
【Test Methods and Remarks】
Preconditioning:Thermal treatmen(t at 150℃ for 1hr) Note1
+0
Conditions for 1 cycle/ Step 1: Minimum operating temperature
℃ 30±3min.
-3
Step 2: Normal temperature
Step 3: Maximum operating temperature
Step 4: Normal temperature
2 to 3min.
+0
-3
℃ 30±3min.
2 to 3min.
Number of cycles:5 times
Recovery : 24±2hrs under the standard condition Note3
14.Humidit(y Steady state)
Appearance:
No abnormality
Capacitance change: Within±15%
Specified Value
Dissipation factor :
7%ma(x HMK), 5%ma(x QMK, SMK).
Insulation resistance: 25MΩμF or 1000MΩ, whichever is smaller.
【Test Methods and Remarks】
Preconditioning:Thermal treatmen(t at 150℃ for 1hr) Note1
Temperature:40±2℃
Humidity:90 to 95%RH
+24
Duration: 500
hrs
-0
Recovery : 24±2hrs under the standard condition Note3
15.Humidity Loading
Appearance:
No abnormality
Capacitance change: Within±15%
Specified Value
Dissipation factor:
7%ma(x HMK), 5%ma(x QMK, SMK).
Insulation resistance: 10MΩμF or 500MΩ, whichever is smaller.
【Test Methods and Remarks】
According to JIS 5102 clause 9.9.
Preconditioning:Voltage treatment Note2
Temperature:40±2℃
Humidity:90 to 95%RH
Applied voltage:Rated voltage
Charge/discharge current:50mA max.
+24
Duration: 500
hrs
-0
Recovery : 24±2hrs under the standard condition Note3
16.High Temperature Loading
Appearance:
No abnormality
Capacitance change: Within±15%
Specified Value
Dissipation factor:
7%ma(x HMK), 5%ma(x QMK, SMK).
Insulation resistance: 50MΩμF or 1000MΩ, whichever is smaller.
【Test Methods and Remarks】
According to JIS 5102 clause 9.10.
Preconditioning:Voltage treatment Note2
Temperature:125±3℃(B7, C7), 85±2℃(BJ)
Applied voltage:Rated voltage×2(HMK)
Rated voltage×1.5(QMK)
Rated voltage×1.2(SMK)
Charge/discharge current:50mA max.
+24
Duration: 1000
hrs
-0
Recovery : 24±2hrs under the standard condition Note3
Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150+0/-10℃ for an hour and kept at room temperature for 24±2hours.
Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and
kept at room temperature for 24±2hours.
Note3 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condi-
tion.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc06_reli_e-01
mlcc06_reli-R2
■ PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1.A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-
pose applications.
◆Operating Voltage(Verification of Rated voltage)
1.The operating voltage for capacitors must always be their rated voltage or less.
Precautions
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2.Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage
having rapid rise time is used in a circuit.
2. PCB Design
◆Pattern configurations(Design of Land-patterns)
1. When capacitors are mounted on PCBs, the amount of solder used(size of fillet)can directly affect the capacitor performance. Therefore, the following items must
be carefully considered in the design of land patterns:
(1)Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper
amount of solder.
Precautions
(2)When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.
◆Pattern configuration(s Capacitor layout on PCBs)
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes(PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.). For this reason, land pattern configurations and positions of capacitors
shall be carefully considered to minimize stresses.
◆Pattern configurations(Design of Land-patterns)
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
(1)Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions(unit: mm)
ꢁWave-soldering
Land patterns for PCBs
Chip capacitor
Land
Type 107
212
2.0
316
3.2
1.6
325
3.2
2.5
L
1.6
0.8
Solder-resist
Size
W
51.25
A
0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
C
B
C
B
B
A
Reflow-soldering
Type 042
063
0.6
0.3
105
1.0
0.5
107
1.6
0.8
212
2.0
316
3.2
1.6
325
3.2
2.5
432
4.5
3.2
Chip capacitor
L
0.4
0.2
Size
W
51.25
W
A
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8
0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5
B
C
L
●LWDC: Recommended land dimensions for reflow-soldering(unit: mm)
LWDC
Type
105
0.52
107
50.8
212
1.25
L
Size
W
1.0
1.6
2.0
W
A
0.18 to 0.22
0.2 to 0.25
0.9 to 1.1
0.25 to 0.3
0.3 to 0.4
1.5 to 1.7
0.5 to 0.7
0.4 to 0.5
1.9 to 2.1
B
C
L
Technical
consider-
ations
●Array type: Recommended land dimensions for reflow-soldering(unit: mm)
Type 096(2 circuits)110(2 circuits)212(2 circuits) 212(4 circuits)
2 circuits
4 circuits
Chip capacitor
L
0.9
1.37
2.0
2.0
c
c
Size
W
0.6
1.0
1.25
1.25
a
b
a
a
b
a
a
0.25 to 0.35
0.15 to 0.25
0.15 to 0.25
0.45
0.35 to 0.45
0.55 to 0.65
0.3 to 0.4
0.64
0.5 to 0.6
0.5 to 0.6
0.5 to 0.6
1.0
0.5 to 0.6
0.5 to 0.6
0.2 to 0.3
0.5
b
c
d
d
d
Land
(2)Examples of good and bad solder application
Items
Not recommended
Recommended
Mixed mounting of
SMD and leaded
components
Component
placement close to
the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
To next page
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_prec_e-01
mlcc_prec-P1
■ PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
2. PCB Design
◆Pattern configuration(s Capacitor layout on PCBs)
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de-
flection.
Items
Not recommended
Recommended
Deflection of board
Technical
consider-
ations
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from
least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location.
3. Mounting
◆Adjustment of mounting machine
1.When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2.Maintenance and inspection of mounting machines shall be conducted periodically.
Precautions ◆Selection of Adhesives
1.When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appro-
priately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further
information.
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points
shall be considerable.
(1)The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
(2)The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
(3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the
PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement:
Items
Not recommended
Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted
periodically.
Technical
consider-
ations
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capaci-
tors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions
shall be noted in the application of adhesives.
(1)Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f . The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
(2)The recommended amount of adhesives is as follows;
[Recommended condition]
Figure
212/316 case sizes as examples
a
b
c
0.3mm min
100 to 120μm
Adhesives shall not contact land
ꢁꢁ
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_prec_e-01
mlcc_prec-P2
■ PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
4. Soldering
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
(1)Flux used shall be less than or equal to 0.1 wt%(in CI equivalent)of halogenated content. Flux having a strong acidity content shall not be applied.
(2)When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
(3)When water-soluble flux is used, special care shall be taken to properly clean the boards.
Precautions
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
◆Selection of Flux
1-1. When too much halogenated substance(Chlorine, etc.)content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
trodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect
the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause
a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be
considered carefully when water-soluble flux is used.
◆Soldering
• Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
• Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
• Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃.
• Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
[Reflow soldering]
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
300
300
Peak 260℃ Max.
Within 10sec.
Preheating
230℃
Within 10 sec.
60sec. 60sec.
200
200
100
0
Slow
cooling
Min.
Min.
Slow cooling
100
Heating above
Preheating 150℃
230℃
Capacitor
PC board
60sec. Min.
40sec. Max.
0
Solder
T
Caution
①The ideal condition is to have solder mass(fillet)controlled to 1/2 to 1/3 of the thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as
close to recommended times as possible.
Technical
consider-
ations
[Wave soldering]
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
300
300
Peak 260℃ Max.
230~250℃
Within 10sec.
Within 3sec.
Preheating
120sec. Min.
200
120sec. Min.
200
Slow
cooling
Slow cooling
Preheating
150℃
100
100
0
0
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
[Hand soldering]
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
400
400
300
200
100
0
400
300
200
100
0
Peak 350℃ Max.
Peak 280℃ Max.
230~280℃
Within 3 sec.
300
Within 3sec.
Within 3sec.
⊿T
Slow cooling
Slow cooling
⊿T
200
Slow cooling
Preheating
150℃ Min.
Preheating
150℃ Min.
100
Preheating
60sec. Min.
60sec. Min.
60sec. Min.
0
⊿T
⊿T≦150℃
⊿T
⊿T≦130℃
316type or less
325type or more
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_prec_e-01
mlcc_prec-P3
■ PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
5. Cleaning
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning(. e.g. to
Precautions
remove soldering flux or other materials from the production process.)
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in
a degradation of the capacitor's electrical properties(especially insulation resistance).
2. Inappropriate cleaning conditions(insufficient or excessive cleaning)may adversely affect the performance of the capacitors.
Technical
consider-
ations
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered
portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked;
Ultrasonic output : 20 W/ℓor less
Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal stor-
age conditions resulting in the deterioration of the capacitor's performance.
Precautions
7. Handling
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or
destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
Precautions
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
(1)If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
(2)Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
◆Storage
1.To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in
the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature
Humidity
: Below 30℃
: Below 70% RH
Precautions
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capaci-
tors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2.The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time,so care shall be taken to design circuits . Even if
capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for 1hour.
Technical If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/
consider- packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability be-
ations
fore using the capacitors.
※RCR-2335B(Safety Application Guide for fixed ceramic capacitors for use in electronic equipment)is published by JEITA.
ꢁPlease check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
*This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_prec_e-01
mlcc_prec-P4
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